Semiconductor device and method of manufacture thereof
AssigneeNXP B.V.
InventorsPhilippe Meunier-Beillard, Mark C.J.C.M. Kramer, Johannes J.T.M. Donkers, Guillaume Boccardi
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AssigneeNXP B.V.
InventorsPhilippe Meunier-Beillard, Mark C.J.C.M. Kramer, Johannes J.T.M. Donkers, Guillaume Boccardi
Estimating the term…
A semiconductor device (10) comprising a bipolar transistor and a field effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22d and 22e) and a base region (33d) of the bipolar transistor. The bipolar transistor is provided with a first insulating cavity (92) provided in the collector region (22d and 22e). The base region (33d) is narrower in the plane of the substrate than the collector region (22d and 22e) due to a second insulating cavity (94) provided around the base region (33d) and between the collector region (22d and 22e) and the emitter region (4). By blocking diffusion from the base region the first insulating cavity (92) provides a reduction in the base collector capacitance and can be described as defining the base contact.
A semiconductor device with a substrate and a semiconductor body comprising a bipolar transistor with, in the following order, a collector region, a base region, and an emitter region, wherein the semiconductor body comprises a projecting mesa within which at least a portion of the collector region and the base region are present and which is surrounded by an isolation region;
A method of manufacturing a semiconductor device with a substrate and a semiconductor body comprising a bipolar transistor with, in the following order, a collector region, a base region, and an emitter region, wherein the semiconductor body comprises a projecting mesa within which at least a portion of the collector region and the base region are present and which is surrounded by an isolation region;
Dependencies are inferred from the claim text.