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US 2011/0214603 A1Published application
Method of manufacturing silicon single crystal
AssigneeCovalent Materials Corporation
InventorToshiro MINAMI
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AssigneeCovalent Materials Corporation
InventorToshiro MINAMI
Estimating the term…
The present invention provides a method of manufacturing a silicon single crystal which can more greatly suppress a pinhole formation in the silicon single crystal, which is a method of manufacturing a silicon single crystal by the Czochralski method in which a silicon material to be silicon melt is melted in a furnace body and then a silicon single crystal is pulled up. After melting the silicon material and before the start of pulling up the silicon single crystal, a heater power is set to be higher than that during the step of pulling up the silicon single crystal, and an internal furnace pressure is set as 30 Torr or less, which is lower than that during the step of pulling up the silicon single crystal, the power and pressure being maintained for a predetermined time, and then the step of pulling up the silicon single crystal is carried out.
A method of manufacturing a silicon single crystal by the Czochralski method which comprises a step of melting a silicon material to be silicon melt in a furnace body and then a step of pulling up the silicon single crystal, wherein after the step of melting said silicon material and before the start of the step of pulling up said silicon single crystal, a heater power is set to be higher than that during the step of pulling up said silicon single crystal, and an internal furnace pressure is set as 30 Torr or less which is lower than that during the step of pulling up said silicon single crystal, said power and pressure being maintained for a predetermined time, and then the step of pulling up said silicon single crystal is carried out.
Dependencies are inferred from the claim text.