Method and apparatus for performing pattern alignment to die
AssigneeMicronic Mydata AB
InventorsMikael Wahlsten, Per-Erik Gustafsson
Life of this patent
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Abstract
In a method for patterning a workpiece provided with dies in a direct write machine, pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.
Claims38
A method for patterning a layer of a workpiece in a direct write machine, wherein the direct write machine is provided with a coordinate system for controlling write operations and the workpiece has dies distributed thereon, wherein the dies distributed on the workpiece are associated with a circuit pattern in the form of original circuit pattern data, the method comprising the steps of:
- a. receiving measurement data associated with the workpiece and indicating measured positions of a plurality of the dies, or group of dies, distributed on the workpiece in relation to at least one reference feature of the workpiece;
- b. detecting the at least one reference feature of the workpiece;
- c. determining the relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- d. transforming the measured positions of the plurality of dies, or group of dies, distributed on the workpiece to a transformed position defined in the coordinate system of the direct write machine based on the determined relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- e. preparing adjusted circuit pattern data for writing on the workpiece based on the original circuit pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to at least a portion of the workpiece area;
- and
- f. writing a pattern on the workpiece according to the adjusted circuit pattern data.
An apparatus for patterning a workpiece in a direct write machine, where the direct write machine is provided with a coordinate system for controlling write operations and the workpiece is having dies distributed thereon, wherein dies distributed on the workpiece are being associated with a circuit pattern in the form of original circuit pattern data;
- the apparatus comprising:
- a. a computer system configured to receiving measurement data being associated with the workpiece and indicating a measured position of a plurality of the dies, or group of dies, distributed on the workpiece in relation to at least one reference feature of the workpiece;
- b. a detecting means configured for detecting the at least one reference feature of the workpiece;
- c. a computerized unit configured to determining the relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- d. a transformation unit configured to transforming the measured position of the plurality of dies, or group of dies, distributed on the workpiece to a transformed position defined in the coordinate system of the direct write machine dependent on the determined relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- e. a data preparation unit configured to preparing adjusted circuit pattern data for writing on the workpiece dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to at least a portion of the workpiece area;
- and
- f. a writing tool control unit configured to control a writing tool to writing a pattern on the workpiece according to the adjusted circuit pattern data.
A computer program product for patterning a workpiece in a direct write machine, where the direct write machine is provided with a coordinate system for controlling write operations and the workpiece is having dies distributed thereon, wherein dies distributed on the workpiece are being associated with a circuit pattern in the form of original circuit pattern data, the computer program product comprising computer program code portions configured to control a computer system to perform the steps of:
- a. receiving measurement data being associated with the workpiece and indicating measured positions of a plurality of the dies, or group of dies, distributed on the workpiece in relation to at least one reference feature of the workpiece;
- b. detecting the at least one reference feature of the workpiece;
- c. determining the relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- d. transforming the measured positions of the plurality of dies, or group of dies, distributed on the workpiece to a transformed position defined in the coordinate system of the direct write machine dependent on the determined relation between the at least one reference feature of the workpiece and the coordinate system of the direct write machine;
- e. preparing adjusted circuit pattern data for writing on the workpiece dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to at least a portion of the workpiece area;
- and
- f. controlling a writing tool to writing a pattern on the workpiece according to the adjusted circuit pattern data.
Dependencies are inferred from the claim text.