Semiconductor Device Having Dummy Pattern and the Method for Fabricating the Same
AssigneeHynix Semiconductor Inc.
InventorByung Ho Nam
Life of this patent
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Abstract
A method for fabricating a semiconductor device includes forming an interlayer dielectric film on a semiconductor substrate including a pattern region and a dummy region, forming a photoresist pattern on the interlayer dielectric film such that the pattern region and the dummy region are partially exposed, etching the interlayer dielectric film exposed through the photoresist pattern as an etching mask to form a contact hole and a dummy contact hole, filling the contact hole and the dummy contact hole with a conductive material to form a contact plug and a dummy plug, depositing a semiconductor layer on the contact plug and the dummy plug, and subjecting the semiconductor layer to patterning to form a semiconductor layer pattern and a dummy pattern.
Claims7
A method for fabricating a semiconductor device having a dummy pattern comprising:
- forming an interlayer dielectric film on a semiconductor substrate including a pattern region and a dummy region;
- forming a photoresist pattern on the interlayer dielectric film such that the pattern region and the dummy region are partially exposed;
- etching the interlayer dielectric film exposed through the photoresist pattern as an etching mask to form a contact hole and a dummy contact hole;
- filling the contact hole and the dummy contact hole with a conductive material to form a contact plug and a dummy plug;
- depositing a semiconductor layer on the contact plug and the dummy plug;
- and
- subjecting the semiconductor layer to patterning to form a semiconductor layer pattern and a dummy pattern.
Dependencies are inferred from the claim text.