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US 2011/0212402 A1Published application
Photosensitive resin composition and its application
OwnerMeng-Yen Chou, Chuan-Zong Lee +2inventors
InventorsMeng-Yen Chou, Chuan-Zong Lee, Pi-Jen Cheng, Jui-Kai Hu
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Abstract
A photosensitive resin composition comprising: a photosensitive polyimide of formula (I); an acrylate monomer; and a photoinitiator, wherein A, B, D, J, m, and n are as defined in the specification.
Claims14
A photosensitive resin composition comprising:
- a photosensitive polyimide of formula (I):
- an acrylate monomer;
- and
- a photoinitiator,
- wherein,
- A and J are independently a tetravalent organic group;
- B and D are independently a divalent organic group;
- n is 0 or an integer of greater than 0;
- m is an integer of greater than 0;
- and
- at least one of A and B has one or more photosensitive group(s) G* selected from a group consisting of:
- wherein,
- R is an unsaturated group with —C═C— or selected from a group consisting of:
- R1 is a substituted or unsubstituted, saturated or unsaturated C1-C20 organic group, R2 is an unsaturated group with —C═C—;
- and R10 is an unsaturated group with an acrylate group.
12 more elements
Dependencies are inferred from the claim text.