Method for designing electronic system

A method for designing an electronic system comprising the steps of:

• calculating a basic interconnect distribution for a first circuit board based on a prediction function configured to predict an interconnect distribution for a circuit board using design information for the first circuit board as first input data;
• calculating, as element interconnection resources, the basic interconnect distribution within a structural limit based on an electrical characteristic;
• and
• outputting a result of comparing the element interconnection resources with the number of requests for a signal requiring the electrical characteristic.

A method for designing an electronic system comprising the steps of:

• calculating a first interconnect distribution for a first circuit board based on a prediction function configured to predict an interconnect distribution for a circuit board using design information for the first circuit board as first input data, calculating, as first element interconnect resources, the basic interconnect distribution within a structural limit based on an electrical characteristic, and outputting a first result of comparing the element interconnection resources with the number of requests for a signal requiring the electrical characteristics;
• calculating a second interconnect distribution for a second circuit board based on a prediction function configured to predict an interconnect distribution for a circuit board using design information for the second circuit board as second input data, calculating, as second element interconnect resources, the basic interconnect distribution within a structural limit based on an electrical characteristic, and outputting a second result of comparing the element interconnection resources with the number of requests for a signal requiring the electrical characteristics;
• and
• outputting an analysis result of comparing the first comparison result with the second comparison result.

An electronic device comprising:

• a semiconductor chip;
• a first package;
• a plurality of connectors configured to connect the semiconductor chip and the first package;
• and
• a plurality of interconnects configured to connect to a plurality of external connectors of the first package,
• wherein
• the plurality of connectors are a group of signals, and
• the plurality of interconnect do not cross each other.