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US 2011/0210419 A1Published application
Multi-chip package with improved signal transmission
AssigneeHynix Semiconductor Inc.
InventorsYoung Won KIM, Jun Ho LEE, Hyun Seok KIM, Boo Ho JUNG, Sun Ki CHO, Yang Hee KIM
Life of this patent
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Abstract
Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.
Claims10
A multi-chip package (MCP) having a plurality of chips comprising:
- a plurality of inductor pads in each of the chips, wherein
- at both sides of a reference inductor pad where is one pad of the inductor pads, first and second inductor pads are formed to generate magnetic fluxes in different directions from each other and the closest pads to the reference inductor pad are the first and second inductor pads
An MCP having a plurality of chips comprising:
- a plurality of inductor pads in each of the chips configured to wirelessly transmit power or signals, wherein
- the inductor pads include a first inductor pad formed at one side of a reference inductor pad and configured to generate magnetic flux in the same direction as the reference inductor pad, and a second inductor pad formed at the other side of the reference inductor pad and configured to generate magnetic flux in a different direction from that of the reference inductor pad.
An MCP having a plurality of chips comprising:
- a plurality of inductor pads, in each of the chips, which are sequentially grouped in pairs, and one pair of inductor pads is configured to generate magnetic flux in a different direction than an adjacent pair of inductor pads.
Dependencies are inferred from the claim text.