Manufacturing Method of Combined Sensor
AssigneeHitachi Automotive Systems, Ltd.
InventorsTakanori AONO, Kengo Suzuki, Akira Koide, Masahide Hayashi
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AssigneeHitachi Automotive Systems, Ltd.
InventorsTakanori AONO, Kengo Suzuki, Akira Koide, Masahide Hayashi
Estimating the term…
A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
A method of manufacturing a combined sensor having an angular rate detector adapted to detect an angular rate by using a vibration device, an acceleration detector adapted to detect an acceleration by using a mass and an adsorbent activated to adsorb a specified gas as typified by a noble gas or an inactive gas, comprising the steps of:
A method of manufacturing a combined sensor having an angular rate detector adapted to detect an angular rate by using a vibration device, an acceleration detector adapted to detect an acceleration by using a mass and a desorption agent adapted to desorb a specified gas typified by a noble gas or an inactive gas, comprising the steps of:
Dependencies are inferred from the claim text.