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AssigneeGebr. Schmid GmbH & Co.
InventorsJorg Lampprecht, Dirk Plaueln, Gerhard Wolber, Lechen Wolber, Michael Wolber, Hans-Jorg Wolber
Estimating the term…
In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit.
A method for detaching wafers from a carrier unit, said wafers being formed by sawing a wafer block fastened to said carrier unit by gluing, and said wafers themselves still being glued to said carrier unit on one side, said carrier unit with said wafers being introduced into an ungluing unit along a uniform movement plane and remaining therein and being enclosed in said ungluing unit by movable wall parts, an ungluing basin being formed using fixed and movable wall parts below and laterally adjacent to said carrier unit and said wafers, wherein solvent for said ungluing step is applied into said ungluing basin and onto said wafers after said formation and said closing of said ungluing basin to dissolve said glued bond and subsequently detach said wafers from said carrier unit.
Dependencies are inferred from the claim text.