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US 2011/0104846 A1Published application
Thermoelectric 3D Cooling
AssigneeInternational Business Machines Corporation
InventorsLouis Lu-Chen Hsu, Ping-Chuan Wang, Xiaojin Wei, Huilong Zhu
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Abstract
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
Claims7
A method of fabricating a semiconductor structure, comprising the steps of:
- providing a first chip with at least one first electronic device;
- providing a second chip with at least one second electronic device and a through silicon via electronically connected to said at least one second electronic device;
- forming a thermoelectric plate with a through silicon via, said thermoelectric plate located between said first and second chip and separated from said first chip by a first coupling layer and separated from said second chip by a second coupling layer.
Dependencies are inferred from the claim text.