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US 2011/0086499 A1Published application
Method for removing photoresist
AssigneeUnited Microelectronics Corp.
InventorsChin-Cheng Chien, Chan-Lon Yang, Chiu-Hsien Yeh
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Abstract
A method for removing a photoresist is disclosed. First, a substrate including a patterned photoresist is provided. Second, an ion implantation is carried out on the substrate. Then, a non-oxidative pre-treatment is carried out on the substrate. The non-oxidative pre-treatment provides hydrogen, a carrier gas and plasma. Later, a photoresist-stripping step is carried out so that the photoresist can be completely removed.
Claims11
A method for removing a photoresist, comprising:
- providing a substrate comprising a patterned photoresist;
- performing an ion implantation on said substrate;
- performing a non-oxidative pre-treatment on said substrate, wherein said non-oxidative pre-treatment provides hydrogen, a carrier gas and plasma;
- and
- performing a photoresist-stripping step so that said patterned photoresist is completely removed.
2 more elements
Dependencies are inferred from the claim text.