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US 2011/0079881 A1Published application
Integrated circuit chip protected against laser attacks
AssigneeSTMicroelectronics (Rousset) SAS
InventorsPascal Fornara, Fabrice Marinet
Life of this patent
Estimating the term…
Abstract
An integrated circuit chip formed inside and on top of a semiconductor substrate and including: in the upper portion of the substrate, an active portion in which components are formed; and under the active portion and at a depth ranging between 5 and 50 μm from the upper surface of the substrate, an area comprising sites for gettering metal impurities and containing metal atoms at a concentration ranging between 1017 and 1018 atoms/cm3.
Claims7
An integrated circuit chip formed inside and on top of a semiconductor substrate and comprising:
- in an upper portion of the substrate, an active portion in which components are formed;
- and
- under the active portion and at a depth ranging between 5 and 50 μm from an upper surface of the substrate, an area comprising sites for gettering metal impurities and containing metal atoms at a concentration ranging between 1017 and 1018 atoms/cm3.
Dependencies are inferred from the claim text.