Device with self aligned stressor and method of making same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKao-Ting Lai, Da-Wen Lin, Hsien-Hsin Lin, Yuan-Ching Peng, Chi-Hsi Wu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKao-Ting Lai, Da-Wen Lin, Hsien-Hsin Lin, Yuan-Ching Peng, Chi-Hsi Wu
Estimating the term…
A method includes providing a substrate comprising a substrate material, a gate dielectric film above the substrate, and a first spacer adjacent the gate dielectric film. The spacer has a first portion in contact with a surface of the substrate and a second portion in contact with a side of the gate dielectric film. A recess is formed in a region of the substrate adjacent to the spacer. The recess is defined by a first sidewall of the substrate material. At least a portion of the first sidewall underlies at least a portion of the spacer. The substrate material beneath the first portion of the spacer is reflowed, so that a top portion of the first sidewall of the substrate material defining the recess is substantially aligned with a boundary between the gate dielectric film and the spacer. The recess is filled with a stressor material.
A method comprising:
A transistor comprising,
Dependencies are inferred from the claim text.