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US 2011/0079649 A1Published application
Sensor
AssigneeNXP B.V.
InventorsRoel DAAMEN, Aurelie HUMBERT, Matthias MERZ, Youri Victorovitch PONOMAREV
Life of this patent
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Abstract
A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other.
Claims9
A sensor comprising:
- a single silicon substrate having a first and a second surface;
- integrated circuitry on the first surface of the silicon substrate;
- a sensor structure on the second surface of the silicon substrate;
- wherein the sensor structure and the integrated circuitry are electrically coupled to each other.
1 more element
The radio frequency identification tag claim 9, wherein the tag is selected from the group comprising:
- a bumped and sawn die;
- a flip-chip strap package;
- and
- a dual in-line package.
1 more element
Dependencies are inferred from the claim text.