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US 2011/0079418 A1Published application
Ceramic wiring board and method of manufacturing thereof
AssigneeIbiden Co., Ltd.
InventorsWataru FURUICHI, Hirokazu Honda
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Abstract
A ceramic wiring board comprises a ceramic substrate and a copper layer formed on the ceramic substrate. The average copper grain radius in the copper layer is approximately equal to or larger than 10 μm.
Claims52
A ceramic wiring board comprising:
- a ceramic substrate;
- and
- a copper layer formed on the ceramic substrate,
- wherein an average copper grain radius in the copper layer is approximately equal to or larger than 10 μm.
1 more element
A ceramic wiring board comprising:
- a ceramic substrate;
- and
- a copper layer formed on the ceramic substrate,
- wherein the copper layer has an elastic modulus of from approximately 30 to approximately 70 GPa.
1 more element
A manufacturing method of a ceramic wiring board comprising the steps of:
- forming a copper layer on a ceramic substrate by a low-temperature growth technique;
- increasing a temperature of the copper layer to or higher than an annealing temperature of copper;
- and
- cooling the copper layer after the temperature increasing.
1 more element
Dependencies are inferred from the claim text.