Pattern formation method and method for manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsKentaro MATSUNAGA, Tomoya Oori, Eishi Shiobara, Yukiko Sato, Yoshihisa Kawamura
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AssigneeKabushiki Kaisha Toshiba
InventorsKentaro MATSUNAGA, Tomoya Oori, Eishi Shiobara, Yukiko Sato, Yoshihisa Kawamura
Estimating the term…
According to one embodiment, a pattern formation method is disclosed. The method includes forming a plurality of regions on a foundation and the plurality of the regions correspond to different pattern sizes. The method includes separating each of a plurality of block copolymers from another one of the plurality of the block copolymers and segregating the each of the plurality of the block copolymers into a corresponding one of the regions. The method includes performing a phase separation of the each of the block copolymers of each of the regions. The method includes selectively removing a designated phase of each of the phase-separated block copolymers to form a pattern of the each of the block copolymers and the pattern has a different pattern size for the each of the regions.
A pattern formation method, comprising:
A method for manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.