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US 2011/0034021 A1Published application
Programmable through silicon via
AssigneeInternational Business Machines Corporation
InventorsKai Di Feng, Louis Lu-Chen Hsu, Ping-Chuan Wang, Zhijian Yang
Life of this patent
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Abstract
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
Claims11
1-15. (canceled)
A method of making programmable through silicon vias in chips, comprising:
- forming devices and circuits on a chip including control circuitry for programming at least one through silicon via in said chip;
- forming metallization and dielectric interconnecting said devices and circuits including metallization for interconnecting said control circuitry for programming said at least one through silicon via;
- forming conductive through silicon vias in said chip for interconnecting said chip to other electronic apparatus;
- forming programmable material within the via of at least one of said conductive through silicon vias to form a programmable through silicon via;
- forming a conductive connection between said programmable material and said control circuitry for programming said programmable through silicon via.
2 more elements
Dependencies are inferred from the claim text.