Method for forming a textured surface on a semiconductor substrate using a nanofabric layer
AssigneeNantero, Inc.
InventorSohrab Kianian
Life of this patent
Estimating the term…
Abstract
A method of forming a textured surface on a substrate or material layer within a semiconductor fabrication process. In one aspect of the disclosure, a sacrificial nanofabric layer is deposited over a material layer and an etch process is used to transfer the surface texture of the nanofabric layer downward to the material layer. In another aspect of the disclosure, a thin material layer is deposited over a nanofabric layer such that the surface texture of the nanofabric layer is transferred upward to the material layer. Within both aspects, varying the porosity of nanofabric layer provides a measure of control over the degree of texturization of the material layer.
Claims20
A method for fabricating a textured surface on a material layer within a semiconductor fabrication process, said method comprising:
- forming a material layer, said material layer including a surface to be textured;
- depositing a sacrificial nanofabric layer on said surface to be textured of said material layer, said nanofabric layer having a porosity, a thickness, and a volume density;
- and
- performing at least one of an etching process and an oxidation process on said sacrificial nanofabric layer to create surface texture on said material layer.
A method for fabricating a textured surface on a material layer within a semiconductor fabrication process, said method comprising:
- forming a nanofabric layer on a surface, said nanofabric layer having a porosity, a thickness, a volume density, and a surface texture;
- and
- depositing a thin material layer on said nanofabric layer, said thin material layer conforming to the surface texture of said nanofabric layer.
Dependencies are inferred from the claim text.