Lead-forming die and method of manufacturing semiconductor device utilizing lead-forming die
AssigneeNEC Electronics Corporation
InventorTakeshi Kimura
Life of this patent
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Abstract
Provided is that a lead-forming die includes an upper die and a lower die disposed so as to oppose the upper die; a supporting unit for semiconductor package, provided on an upper face of the lower die; a moving unit provided on a lower face of the upper die and movable in a direction that the upper die and the lower die oppose each other; a plurality of shafts supported by the moving unit so as to axially move with respect thereto; a presser provided above the supporting unit for semiconductor package, and at a lower end portion of the shaft; and a locking device that stops a movement of the shaft, provided between the upper die and the moving unit.
Claims9
A lead-forming die for a semiconductor package, including an upper die and a lower die disposed so as to oppose said upper die, comprising:
- a supporting unit for semiconductor package, provided on an upper face of said lower die;
- a moving unit provided on a lower face of said upper die and movable in a opposing direction that said upper die and said lower die oppose each other;
- a plurality of shafts supported by said moving unit so as to axially move with respect thereto;
- a presser provided at a lower end portion of said shaft, and above said supporting unit;
- and
- a locking device that stops a movement of said shaft, and is located between said upper die and said moving unit;
- wherein said locking device stops said movement of said shaft to thereby fix a position of said presser with respect to said moving unit, while said upper die is moving toward said upper face of said lower die and after said moving unit stops moving by contact with said lower die.
Dependencies are inferred from the claim text.