Thin film deposition apparatus including deposition blade

A thin film deposition apparatus for depositing a deposition material on a substrate, the thin film deposition apparatus comprising:

• a deposition source that is disposed opposite to the substrate and comprises the deposition material;
• a first nozzle unit disposed between the substrate and the deposition source and comprising a plurality of first slit units arranged in a first direction of the substrate;
• a second nozzle unit disposed between the first nozzle unit and the substrate and comprising a plurality of second slit units arranged in the first direction of the substrate;
• a barrier wall assembly disposed between the first nozzle unit and the second nozzle unit and comprising a plurality of barrier walls arranged to partition a space between the first nozzle unit and the second nozzle unit, the barrier wall assembly being separated from the second nozzle unit by a gap having a first distance, and
• a deposition blade which is selectively disposed in the gap between the barrier wall assembly and the second nozzle unit during a stand-by mode of the thin film deposition apparatus and which is removed when the thin film deposition apparatus is not in the stand-by mode.

A thin film deposition apparatus for depositing a deposition material on a substrate, the thin film deposition apparatus comprising:

• a deposition source disposed opposite to the substrate and comprising the deposition material;
• a first nozzle unit disposed between the substrate and the deposition source and comprising a plurality of first slit units arranged in a first direction of the substrate;
• a second nozzle unit disposed between the first nozzle unit and the substrate and comprising a plurality of second slit units arranged in the first direction of the substrate;
• at least one barrier member assembly disposed between the first nozzle unit and the second nozzle unit and partitioning a space between the first nozzle unit and the second nozzle unit;
• and
• a deposition blade which is selectively disposed in a gap formed between the first nozzle unit and the at least one barrier member assembly, between elements of the at least one barrier member assembly, or between the at least one barrier member assembly and the second nozzle unit when the thin film deposition apparatus is moved up and down during a stand-by mode and which is removed when the thin film deposition apparatus is not in the stand-by mode.

A thin film deposition apparatus for depositing a deposition material on a substrate, the thin film deposition apparatus comprising:

• a deposition source which holds the deposition material;
• a first nozzle unit disposed between the substrate and the deposition source and comprising a plurality of first slit units arranged in a first direction of the substrate;
• a second nozzle unit disposed between the first nozzle unit and the substrate and comprising a plurality of second slit units arranged in the first direction of the substrate such that, during a position process, the deposition material passes through the first and second slit units via a space between the first and second nozzle units;
• and
• a deposition blade that is disposed in the space between the first nozzle unit and the second nozzle unit such that the deposition material is deposited on the deposition blade during a first mode, and is removed from the space during the deposition process to allow the deposition on the substrate during a second mode.

A method of performing deposition on a substrate, the method comprising:

• completing a deposition process on the substrate by depositing a deposition material from a deposition source which holds the deposition material after passing the deposition material through a first nozzle unit comprising a plurality of first slit units arranged in a first direction of the substrate, and a second nozzle unit comprising a plurality of second slit units arranged in the first direction;
• and
• entering a stand by mode between the deposition process and another deposition process;
• inserting a deposition blade into a space between first and second nozzle units to block the deposition material passing through the first nozzle from passing through the second nozzle unit during the stand-by mode;
• and
• removing the deposition blade from the space to allow the deposition material to pass through the second nozzle unit during the another deposition process.