Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsZHI-SHENG LIAN, GEN-PING DENG
Life of this patent
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Abstract
A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
Claims13
A heat dissipation device dissipating heat generated by a heat-generating component mounted on a printed circuit board, comprising:
- a heat absorbing board with a bottom thereof attached to the heat-generating component;
- a heat sink;
- a heat pipe having two ends thereof respectively connecting the heat absorbing board and the heat sink;
- a centrifugal fan located at a lateral side of the heat sink;
- and
- a clip having an engaging portion fixed with the heat absorbing board, and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to secure the heat absorbing board on the heat-generating component.
A heat dissipation device dissipating heat generated by a heat-generating component mounted on a printed circuit board, comprising:
- a heat absorbing board with a bottom thereof attached to the heat-generating component;
- two heat sinks;
- two heat pipes respectively connecting the heat absorbing board and the two heat sinks;
- two centrifugal fans each of which is located at a lateral side of a corresponding heat sink;
- and
- two clips each comprising an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.
Dependencies are inferred from the claim text.