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US 2011/0032263 A1Published application
Integrated circuit device and electronic equipment
AssigneeSeiko Epson Corporation
InventorsHideki OGAWA, Yoshiro Iwasa
Life of this patent
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Abstract
An integrated circuit device includes: a first pad to an ith pad connected to a first memory pad to an ith memory pad of a memory stacked in the integrated circuit device; a jth pad to a kth pad connected to a jth memory pad to a kth (1<i<j<k) memory pad of the memory; and at least one pad arranged between the ith pad and the jth pad, wherein the at least one pad is not connected to a memory pad of the memory and serves as a pad for input or output a signal between an external device and the integrated circuit device.
Claims17
An integrated circuit device comprising:
- a first pad to an ith pad connected to a first memory pad to an ith memory pad of a memory stacked in the integrated circuit device;
- a jth pad to a kth pad connected to a jth memory pad to a kth (1<i<j<k) memory pad of the memory;
- and
- at least one pad arranged between the ith pad and the jth pad,
- wherein the at least one pad is not connected to a memory pad of the memory and serves as a pad for input or output a signal between an external device and the integrated circuit device.
2 more elements
Dependencies are inferred from the claim text.