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US 2011/0031632 A1Published application
Die stacking with an annular via having a recessed socket
AssigneeMicron Technology, Inc.
InventorDave Pratt
Life of this patent
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Abstract
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
Claims20
An apparatus comprising:
- an annular through-substrate via (TSV) with a planar end portion covering a portion of a first surface of a substrate and with portions of the annular TSV exposed at a second surface of the substrate;
- a nonconductive layer covering portions of the second surface surrounding the annular TSV and leaving a recessed portion inside the annular TSV at the second surface uncovered by the nonconductive layer;
- and
- an under bump layer on the recessed portion forming a conductive socket on the second surface.
1 more element
A method comprising:
- forming an annular through-substrate via (TSV) with a planar end portion covering a portion of a first surface of a substrate and with portions of the annular TSV exposed at a second surface of the substrate;
- forming a nonconductive layer covering portions of the second surface of the substrate surrounding the annular TSV and leaving a recessed portion inside the annular TSV at the second surface uncovered by the nonconductive layer;
- and
- depositing an under bump layer on the recessed portion forming a conductive socket on the second surface of the substrate.
1 more element
A method comprising:
- etching a first surface of the substrate to form an annular opening;
- forming a first passivation layer over sidewalls of the annular opening;
- filling the annular opening with a first conductive material, such that a metal via is formed, the metal via including a planar end portion covering a portion of the first surface of the substrate and extending on the first surface outward from outer edges of the annular opening;
- removing a substrate material from a second surface of the substrate including an area surrounded by the metal via, such that a portion of the metal via extends out from the second surface of the substrate;
- removing at least a portion of the first passivation layer from inner walls and an inner portion of exposed ends of the metal via at the second surface of the substrate;
- forming a second passivation layer over a portion of the second surface of the substrate surrounding the inner portion of the exposed ends of the metal via, such that a recessed area surrounded by inner walls of the metal via is formed;
- and
- coating a layer of a second conductive material on the recessed area to form a conductive socket.
5 more elements
Dependencies are inferred from the claim text.