Structures and methods for improving solder bump connections in semiconductor devices

A structure, comprising:

• a plurality of discrete metal islands formed in a dielectric layer and in contact with an underlying metal, the plurality of discrete metal islands comprising a metal liner and a metal material over the metal liner;
• one or more dielectric layers with a via exposing a surface of the discrete metal islands;
• a capture pad and a conductive pad formed in the via and in direct contact with the exposed surface of the plurality of discrete metal islands and portions of the one or more dielectric layers;
• a lead free solder bump directly on the capture pad and the conductive pad, and in electrical connection to the plurality of discrete metal line islands;
• and
• a laminate structure bonded to the lead free solder bump.