Methods for fabricating semiconductor components and packaged semiconductor components

A semiconductor component, comprising:

• a die having a semiconductor substrate with a front surface, a back surface, and a sidewall between the front surface and the back surface, wherein the sidewall has a shoulder projecting outwardly;
• a first polymeric cover having a front portion covering the front surface and a first extension projecting from the front portion to the shoulder;
• and
• a second polymeric cover having a back portion covering the back surface and a second extension projecting from the back portion to the shoulder, wherein the shoulder separates the first extension from the second extension.

A semiconductor apparatus, comprising:

• a semiconductor wafer having a plurality of dies with integrated circuits, a first side, a plurality of first channels in the first side located in lanes between the dies, a second side, and a plurality of second channels in the second side in the lanes;
• a first polymeric material on the first side, wherein a portion of the first polymeric material is in the first channels;
• and
• a second polymeric material on the second side, wherein a portion of the second polymeric material is in the second channels.