Substrate cleaning method and substrate cleaning apparatus

A substrate cleaning method for cleaning a semiconductor substrate by discharging droplets of a cleaning liquid toward the semiconductor substrate, wherein

• droplets of a cleaning liquid having an average droplet diameter in the range from 15 to 30 μm and a droplet diameter distribution where a value of 3σ (where σ is a standard deviation) does not exceed 2 μm are produced and discharged toward a semiconductor substrate.

A substrate cleaning method for cleaning a substrate by discharging droplets of a cleaning liquid toward the substrate, wherein

• a cleaning liquid is fed to a tubular body including a plurality of discharge holes formed in a wall surface thereof, and vibrations are applied to the cleaning liquid, whereby droplets of the cleaning liquid having an average droplet diameter in the range from 15 to 200 μm and a droplet diameter distribution where a value of 3σ (where σ is a standard deviation) does not exceed 10% of said average droplet diameter are discharged from said plurality of discharge holes toward a substrate.

A substrate cleaning method for cleaning a semiconductor substrate by discharging droplets of a cleaning liquid toward the semiconductor substrate, wherein

• a cleaning liquid is fed to a tubular body including a plurality of discharge holes formed in a wall surface thereof, and vibrations are applied to the cleaning liquid, whereby droplets of the cleaning liquid having an average droplet diameter in the range from 15 to 30 μm and a droplet diameter distribution where a value of 3σ (where σ is a standard deviation) does not exceed 2 μm are discharged from said plurality of discharge holes toward a semiconductor substrate.

A substrate cleaning apparatus for cleaning a substrate by discharging droplets of a cleaning liquid toward the substrate, comprising

• a cleaning nozzle having a tubular body including a plurality of discharge holes formed in a wall surface thereof, and a piezoelectric element affixed to said wall surface, said cleaning nozzle being configured to apply vibrations to a cleaning liquid fed to said tubular body from said piezoelectric element, thereby discharging droplets of the cleaning liquid having an average droplet diameter in the range from 15 to 200 μm and a droplet diameter distribution where a value of 3σ (where σ is a standard deviation) does not exceed 10% of said average droplet diameter from said plurality of discharge holes toward a substrate.

A substrate cleaning apparatus for cleaning a semiconductor substrate by discharging droplets of a cleaning liquid toward the semiconductor substrate, wherein

• a cleaning nozzle having a tubular body including a plurality of discharge holes formed in a wall surface thereof, and a piezoelectric element affixed to said wall surface, said cleaning nozzle being configured to apply vibrations to a cleaning liquid fed to said tubular body from said piezoelectric element, thereby discharging droplets of the cleaning liquid having an average droplet diameter in the range from 15 to 30 μm and a droplet diameter distribution where a value of 3σ (where σ is a standard deviation) does not exceed 2 μm from said plurality of discharge holes toward a semiconductor substrate.