Manufacturing Apparatus For Depositing A Material On An Electrode For Use Therein
AssigneeHemlock Semiconductor Corporation
InventorsDavid Hillabrand, Theodore Knapp
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AssigneeHemlock Semiconductor Corporation
InventorsDavid Hillabrand, Theodore Knapp
Estimating the term…
The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The manufacturing apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber for coupling to the socket. The electrode has an exterior surface having a contact region that is adapted to contact the socket. A contact region coating is disposed on the contact region of the exterior surface of the electrode. The contact region coating has an electrical conductivity of at least 9×106 Siemens/meter and a corrosion resistance that is higher than silver in a galvanic series that is based upon room temperature sea water as an electrolyte.
A manufacturing apparatus for deposition of a material on a carrier body having a first end and a second end spaced from each other with a socket disposed at each end of the carrier body, said apparatus comprising:
An electrode for use with a manufacturing apparatus to deposit a material onto a carrier body having a first end and a second end spaced from each other with a socket disposed at each end of the carrier body, said electrode comprising:
Dependencies are inferred from the claim text.