Sputtering deposition method and apparatus

A sputtering deposition apparatus, comprising:

• a first chamber;
• a second chamber communicated with the first chamber;
• a plurality of first carriers received in the first chamber;
• a plurality of second carriers received in the second chamber;
• a separating device positioned between the first chamber and the second chamber and constructed to open or hermetically close the first chamber and second chamber;
• and
• an exchanging device configured for exchanging the first and second carriers in the first chamber and the second chamber;
• two air pumps connected to the first chamber and the second chamber, the air pumps being configured to vacuumize the first chamber and the second chamber.

A sputtering deposition apparatus, comprising:

• a first chamber;
• a second chamber;
• a separating device connected the first chamber to the second chamber and configured to be opened to communicate the first chamber to the second chamber, and to be closed to separate the first chamber from the second chamber;
• a plurality of first carriers capable of being moved from one of the first and second chambers into another one of the first and second chambers;
• and
• a plurality of second carriers capable of being moved from one of the first and second chambers into another one of the first and second chambers.