Post sputter wash process module
OwnerDave Frost, Mike Rogowski +3inventors
InventorsDave Frost, Mike Rogowski, Yassin Mehmandoust, Tom Poplawski, Stan Young
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Abstract
In one embodiment, a method for cleaning a substrate in a cleaning module is disclosed. The method includes an operation that receives the substrate into a first level of the cleaning module. In another operation, the substrate is spun while contemporaneously applying a cleaning fluid to top and bottom surfaces of the substrate. In yet another operation, the substrate is spun at a second level of the cleaning module. The method also includes an operation to dry the substrate in an enclosed cavity at a third level of the cleaning module.
Claims26
A method for cleaning a substrate in a cleaning module, comprising method operations of:
- receiving the substrate into a first level of the cleaning module;
- spinning the substrate while contemporaneously applying a cleaning fluid to top and bottom surfaces of the substrate;
- spinning the substrate at a second level of the cleaning module;
- and
- drying the substrate in an enclosed cavity at a third level of the cleaning module.
A cleaning module, comprising:
- an enclosure in which multiple cleaning levels are provided, the enclosure including,
- a lower inner enclosure configured to accommodate a wet cleaning operation,
- a middle partial enclosure wherein a spinning operation of a substrate being cleaned is performed;
- and
- an upper enclosure configured to close around the substrate, the upper enclosure configured to dry the substrate at an elevated temperature.
A cleaning apparatus for a substrate, comprising:
- a first chamber being configured to apply a rinse agent to the substrate;
- a second chamber being configured to perform an ambient temperature drying operation;
- and
- a third chamber being configured to perform an elevated temperature drying operation.
A substrate cleaned by process operations, comprising:
- securing the substrate to a collet affixed to a spindle;
- spinning the substrate while applying a cleaning fluid to top and bottom surfaces of substrate;
- extending the spindle to transition the substrate from a first chamber to a second chamber of the substrate cleaning assembly;
- spinning the substrate within the second chamber of the substrate cleaning assembly;
- extending the spindle to transition the substrate from the second chamber into a third chamber of the substrate cleaning assembly;
- and
- heating the substrate while spinning the substrate within the third chamber.
Dependencies are inferred from the claim text.