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US 2011/0030617 A1Published application
Plasma system
AssigneeAlytus Corporation S.A.
InventorRicardo Enrique Biana
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Abstract
System and technique for plasma enhanced chemical deposition (PECVD) wherein selective surfaces of tubular substrates may be treated to deposit thin films of a desired matter, wherein one of the electrodes employed in the plasma system is conformed by the substrate or workpiece without the need of bulky plasma reactors.
Claims12
A plasma system for plasma-enhanced chemical vapor deposition, the system comprising:
- a vacuum chamber,
- at least two electrodes,
- a substrate, and
- a matter to be ionized for depositing onto at least one desired surface of the substrate,
- wherein the substrate comprises a tubular workpiece having two ends, with at least one of the two ends being an open end closed by a removable end cap in a manner that the vacuum chamber is defined by the workpiece and the cap, and wherein the work piece defines one of the electrodes with the other one of the electrodes being extended through the end cap and into the workpiece, and with at least one desired surface of the substrate being defined by an inner surface of the tubular workpiece.
2 more elements
Dependencies are inferred from the claim text.