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US 2011/0030400 A1Published application
Evaporator and cooling circuit
AssigneeABB Research Ltd.
InventorsFrancesco AGOSTINI, Berk YESIN, Bruno AGOSTINI
Life of this patent
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Abstract
An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.
Claims50
Evaporator for a cooling circuit for cooling at least one heat emitting device by evaporation of a cooling fluid, said evaporator comprising:
- a top collector having a volume for receiving the cooling fluid therein;
- a bottom collector having a volume for receiving the cooling fluid therein;
- and
- an evaporator body, comprising,
- at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device;
- a plurality of evaporation channels being in thermal contact with the at least one thermoconducting wall and being fluidly connected to the bottom collector and to the top collector each of the evaporation channels comprising a respective evaporation channel intake for intaking cooling fluid from the bottom collector in an operating state of the evaporator, and a respective evaporation channel outlet for letting out the cooling fluid to the top collector in the operating state,
- the evaporation channels being dimensioned for establishing boiling of the liquid cooling fluid in the evaporation channels in the operating state, so that in the operating state the cooling fluid therein is at least partially turned into vapor, and for establishing bubble pumping so that the cooling fluid is then driven out from the evaporation channels via the respective evaporation channel outlets to the top collector;
- and
- a plurality of return channels fluidly connected to the bottom collector and to the top collector, each of the return channels comprising a respective return channel intake for intake of the cooling fluid from the top collector in the operating state, and a respective return channel outlet for letting out the cooling fluid to the bottom collector in the operating state.
6 more elements
Evaporator for a cooling circuit for cooling at least one heat emitting device by evaporation of a cooling fluid, said evaporator comprising:
- a top collector having a volume for receiving the cooling fluid therein;
- a bottom collector having a volume for receiving the cooling fluid therein;
- a liquid outlet port at the bottom collector connectable to a condenser of the cooling circuit for letting in cooling fluid from the condenser to the bottom collector in an operating state of the evaporator;
- and
- an evaporator body comprising:
- at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device;
- at least one evaporation channel(s) being in thermal contact with the at least one thermoconducting wall and being fluidly connected to the bottom collector and to the top collector, each of the evaporation channel(s) comprising a respective evaporation channel intake for intake of the cooling fluid from the bottom collector in the operating state, and a respective evaporation channel outlet for letting out the cooling fluid to the top collector in the operating state;
- and
- at least one return channel(s) fluidly connected to the bottom collector and to the top collector, each of the return channel(s) comprising a respective return channel intake for intake of the cooling fluid from the top collector in the operating state, and a respective return channel outlet for letting out the cooling fluid to the bottom collector in the operating state.
6 more elements
Method of cooling a heat emitting device by an evaporator including a top collector;
- a bottom collector and an evaporator body with at least one thermoconducting wall, a plurality of evaporation channels and a plurality of return channel and a cooling fluid in the evaporation channels, the method comprising:
- transferring heat from the heat emitting device via the thermoconducting wall to the plurality of evaporation channels;
- boiling of the liquid cooling fluid in the evaporation channels, so that the cooling fluid therein is at least partially turned into vapor;
- bubble pumping the liquid cooling fluid in the evaporation channels, so that the cooling fluid therein is driven out from the evaporation channels to the top collector, and replaced by liquid cooling fluid entering the evaporation channels from the bottom collector;
- and
- returning a liquid portion of the cooling fluid from the top collector to the bottom collector via the plurality of return channels, wherein the liquid portion forms a predominantly liquid portion.
3 more elements
Dependencies are inferred from the claim text.