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US 2010/0304562 A1Published application
Electroless deposition of cobalt alloys
AssigneeLam Research Corporation
InventorsAlgirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Abstract
Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
Claims17
A solution comprising:
- a cobalt salt;
- a complexing agent configured to deposit a cobalt layer on copper using the cobalt salt, the complexing agent comprising an amine compound;
- and
- a pH adjuster configured to adjust a pH of the solution to below 7.0.
1 more element
A method comprising:
- preparing a solution configured to deposit a cobalt layer on copper, having a pH below
- 7.0 and comprising:
- a cobalt(II) salt;
- a complexing agent including at least two amine groups;
- and
- a pH adjuster configured to adjust the pH to below 7.0;
- immersing a copper surface into the solution;
- and
- depositing a cobalt-alloy layer on the copper surface using the solution.
6 more elements
Dependencies are inferred from the claim text.