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US 2010/0304558 A1Published application
Methods using silver compositions for micro-deposition direct writing silver conductor lines on photovoltaic wafers
AssigneeE. I. Du Pont de Nemours and Company
InventorsHaixin Yang, Roberto Irizarry, Patricia J. Ollivier
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Abstract
Embodiments of the invention relate to a silicon semiconductor device, and a conductive thick film composition for use in a solar cell device.
Claims14
A method of manufacturing a semiconductor device comprising the steps of:
- (a) providing a semiconductor substrate, one or more insulating films, and the thick film composition;
- (b) applying the insulating film to the semiconductor substrate,
- (c) applying the thick film composition to the insulating film on the semiconductor substrate, and
- (d) firing the semiconductor, insulating film and thick film composition, wherein the thick film composition comprises:
- (a) one or more conductive materials;
- (b) one or more inorganic binders;
- and
- (c) organic vehicle,
- wherein 1 to 15% of the inorganic components are submicron particles.
6 more elements
Dependencies are inferred from the claim text.