Chemically amplified positive photoresist composition
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsOgnian N. Dimov, Binod B. De
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Abstract
A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.
Claims23
A photoresist composition, comprising:
- one or more resin binders that include one or more acid sensitive protecting groups and that are substantially free of phenolic groups protected by acetal or ketal groups and wherein the binder becomes alkali-soluble by the action of an acid to remove the acid sensitive protecting groups;
- one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups;
- one or more ionic non-photosensitive additives of an iminium salt;
- and
- one or more solvents.
Dependencies are inferred from the claim text.