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US 2010/0304177 A1Published application
Metal material for electrical electronic component
AssigneeFurukawa Electric Co., Ltd.
InventorsKazuo Yoshida, Kyota Susai, Takeo Uno, Shuichi Kitagawa, Kengo Mitose
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Abstract
A metallic material for an electrical electronic includes a CU-Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.
Claims20
A metallic material for an electrical electronic component comprising a Cu—Sn alloy layer provided on a conductive base,
- wherein said Cu—Sn alloy layer has a Cu concentration gradually decreasing from a side of the conductive base toward a surface side thereof, said Cu—Sn alloy layer has a thickness of 0.1 to 3.0 μm, and said Cu—Sn alloy layer exists at least on a part of a surface of the metallic material.
(canceled)
A method for manufacturing a metallic material for an electrical electronic component, comprising the steps of:
- laminating sequentially Cu and Sn on a conductive base or one of Ni, Co and Fe or an alloy thereof to form a laminate;
- applying a heat treatment on the laminate;
- and
- applying a cooling treatment on the laminate treated with the heat treatment,
- wherein the metallic material comprises a Cu—Sn alloy layer provided on the conductive base,
- said Cu—Sn alloy layer has a thickness of 0.1 to 3.0 μm,
- said Cu—Sn alloy layer exists at least on a part of a surface of the metallic material, and
- said Cu—Sn alloy layer has a Cu concentration gradually decreasing from a side of the conductive base toward a surface side thereof.
5 more elements
18-19. (canceled)
Dependencies are inferred from the claim text.