Controlling Warpage in BGA Components in a Re-flow Process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Jen Kao, Chen-Fa Tsai, Chien-Wen Chen
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Abstract
A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.
Claims20
A method of manufacturing an integrated circuit package, the method comprising:
- providing a ball grid array (BGA) module comprising BGA balls on a side of the BGA module;
- providing a base substrate;
- placing the BGA module on the base substrate, wherein the BGA balls are between the BGA module and the base substrate;
- applying an adhesive between and contacting the BGA module and the base substrate;
- curing the adhesive;
- and
- re-flowing the BGA balls after the step of curing the adhesive.
A method of manufacturing an integrated circuit package, the method comprising:
- providing a ball grid array (BGA) module comprising BGA balls on a side of the BGA module;
- providing a printed circuit board (PCB);
- applying an adhesive on the PCB;
- placing the BGA module on the PCB, with edges of the BGA module contacting the adhesive, wherein the BGA balls are between the BGA module and the PCB;
- heating the BGA module and the PCB to cure the adhesive;
- and
- re-flowing the BGA balls after the adhesive is cured.
An integrated circuit package comprising:
- a ball grid array (BGA) module;
- a base substrate;
- BGA balls between and contacting the BGA module and the base substrate;
- and
- an adhesive between and contacting the BGA module and the base substrate, wherein the adhesive comprises discrete portions distributed along edges of the BGA module, and wherein the adhesive has a curing temperature lower than a start-melting temperature of the BGA balls.
Dependencies are inferred from the claim text.