Lead frame with stitching-assisting structures, electronic device having such lead frame and apparatus having such electronic device

An electronic device, comprising

• a circuit component;
• and
• a lead frame, with which the circuit component is packaged, the lead frame comprising:
• a base;
• and
• at least two pins protruding from the base, each of the pins having at least one stitching-assisting structure.

An apparatus, comprising:

• a flexible substrate capable of being sewn through by stitching;
• an electronic device, comprising:
• a circuit component;
• and
• a lead frame with which the circuit component is packaged, the lead frame comprising:
• a base;
• and
• at least two pins protruding from the base, each of the pins having at least one stitching-assisting structure;
• and
• a plurality of conductive threads being sewn through the flexible substrate and passing through and being interwoven between the stitching-assisting structures to fix the electronic device on the flexible substrate, wherein the conductive threads electrically contact with the stitching-assisting structures.