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AssigneeInfineon Technologies AG
InventorsPeter Kanschat, Olaf Hohlfeld, Thilo Stolze
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The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.
A power semiconductor module mountable on a heat sink, the power semiconductor module comprising a module housing and at least one substrate populated with at least one power semiconductor chip, the module housing comprising a bottom side and a top side spaced away from the bottom side in a positive vertical direction, the substrate comprising a bottom side facing away from an interior of the module housing, and wherein the substrate:
A method for fabricating a power semiconductor module comprising:
Dependencies are inferred from the claim text.