Back to results
US 2010/0302740 A1Published application
Methods of cooling semiconductor dies
AssigneeMicron Technology, Inc.
InventorsChandra Mouli, Gurtej S. Sandhu
Life of this patent
Estimating the term…
Abstract
The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.
Claims11
1-35. (canceled)
A method of cooling a semiconductor die, comprising:
- providing a semiconductor package comprising a semiconductor die having a frontside surface and a backside surface in opposing relation to the frontside surface, with the backside surface having a plurality of grooves extending therein;
- and
- forcing coolant material through the grooves.
44-56. (canceled)
A method of cooling a semiconductor die, comprising:
- providing a semiconductor package comprising a semiconductor die having a frontside surface and a backside surface in opposing relation to the frontside surface, with the backside surface having a plurality of grooves extending therein, and wherein metal lines the grooves;
- and
- uses a fan to blow coolant material through the grooves.
Dependencies are inferred from the claim text.