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US 2010/0302520 A1Published application
Cluster e-beam lithography system
AssigneeHermes Microvision, Inc.
InventorArchie Hwang
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Abstract
A hybrid lithography system is disclosed to achieve high throughput and high resolution of sub 32 nm lithography. The hybrid system contains an optical lithographer for expose pattern area where features above 32 nm, and a cluster E-beam lithography system for expose pattern area where features is sub 32 nm
Claims14
A hybrid lithography system comprising:
- an optical lithographer for exposing rough patterns on wafers;
- a database for storing data from the optical lithographer;
- and
- a cluster E-beam lithography system for exposing fine patterns on the wafers, wherein the cluster E-beam lithography system includes a plurality of E-beam devices and a control center for managing wafers to be lithographically processed by the plurality of E-beam devices, each E-beam device having a compound objective lens for inspecting wafers and drawing fine patterns on the wafers in situ.
1 more element
A hybrid lithography system comprising:
- an optical lithographer for exposing rough patterns on wafers;
- a database for storing data from the optical lithographer;
- and
- an E-beam lithography device for exposing fine patterns on the wafers, wherein the E-beam lithography device has a multi-axis magnetic lens for controlling a plurality of electron beams on the wafers.
1 more element
A lithography process, comprising:
- performing optical lithography process to wafers with a rough pattern thereon in an optical lithography system;
- transferring the wafers from the optical lithography system to a control center of a cluster EBL system;
- distributing the wafers into E-beam devices of the cluster EBL system;
- receiving data processed by the optical lithography system;
- inspecting the rough pattern on the wafers by using the E-beam devices;
- computing key lithography data for E-beams device;
- managing an E-beam lithography process dataflow;
- and
- performing the E-beam lithography process to the wafers.
6 more elements
Dependencies are inferred from the claim text.