Flexible circuit board material and method for producing the same
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsSteffen Guenther, Waldemar Schoenberger, Steffen Straach, Nicolas Schiller, Volker Kirchhoff
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Abstract
A method for producing a flexible circuit board material having a polymer substrate and a copper layer. The method includes depositing a layer of titanium oxide to be between the polymer substrate and the copper layer. The layer of titanium oxide and the copper layer are deposited using vacuum methods.
Claims20
-17. (canceled)
A method for producing a flexible circuit board material having a polymer substrate and a copper layer, the method comprising:
- depositing a layer of titanium oxide to be between the polymer substrate and the copper layer,
- wherein the layer of titanium oxide and the copper layer are deposited using vacuum methods.
A flexible circuit board material, comprising:
- a polymer substrate;
- a layer of titanium dioxide;
- and
- a copper layer, wherein the layer of titanium oxide is deposited between the polymer substrate and the copper layer.
A method for producing a flexible circuit board material having a polymer substrate and a copper layer, the method comprising:
- depositing a layer of titanium oxide on the polymer substrate;
- and
- depositing the copper layer, such that the layer of titanium oxide is arranged between the polymer substrate and the copper layer,
- wherein the depositing the layer of titanium oxide and the depositing the copper layer are deposited using vacuum methods.
Dependencies are inferred from the claim text.