Pattern exposure method, conductive film producing method, and conductive film
AssigneeFUJIFILM Corporation
InventorsToyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi
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AssigneeFUJIFILM Corporation
InventorsToyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi
Estimating the term…
There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 μm, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.
A pattern exposure method comprising the steps of:
A method for producing a conductive film, comprising the steps of
A conductive film comprising a plurality of conductive portions of conductive thin metal wires and a plurality of opening portions, wherein
Dependencies are inferred from the claim text.