Modified heat pipe for phase change cooling of electronic devices

A heat pipe comprising:

• a pipe structure attached to an electronic device for receiving heat from the electronic device;
• and
• an expandable chamber connected to the pipe structure for dissipating the received heat through a phase change of water that flows through the pipe structure and the expandable chamber,
• wherein the expandable chamber is configured to change in volume so as to control one or both of a temperature and a pressure in the pipe structure.

A method for forming a heat pipe comprising:

• providing a hollow metal casing comprising a pipe structure, wherein a first end of the pipe structure comprises an evaporating section for receiving heat;
• placing an expandable chamber in the hollow metal casing and connected at a second end of the pipe structure,
• wherein the expandable chamber comprises a condensing section for releasing the heat and is configured to change in volume to control one or both of a temperature and a pressure in the hollow metal casing;
• and
• arranging a capillary system at an inner surface of the pipe structure and the expandable chamber.

A method for dissipating heat comprising:

• providing a hollow metal casing comprising a pipe structure and an expandable chamber connected at a first end of the pipe structure;
• wherein the expandable chamber is configured to change in volume to control one or both of a temperature and a pressure in the hollow metal casing;
• packaging an electronic device at a second end of the pipe structure;
• and
• flowing a fluid in the hollow metal casing to receive heat transmitted from the electronic device and thereby generating a vapor that is condensed in the expandable chamber to release the heat.