Wafer cleaning with immersed stream or spray nozzle
AssigneeMicron Technology, Inc.
InventorDonald L. Yates
Life of this patent
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Abstract
Several methods of removing contaminant particles from a surface of a substrate are disclosed herein. In one embodiment, the method includes directing an incompressible fluid spray onto a surface of a substrate to remove contaminant particles from the surface. In an embodiment, the surface of the substrate and the nozzle are both immersed in an incompressible fluid. The fluid can flow across the surface of the substrate to remove the contaminant particles from the area. The fluid spray can be positioned normal to the substrate surface, or can be positioned at an angle relative to the substrate surface.
Claims40
A method for removing residual particles from a semiconductor wafer, comprising:
- immersing at least a portion of a semiconductor wafer in a first incompressible fluid;
- immersing a nozzle orifice in the first incompressible fluid;
- and
- flowing a stream of a second incompressible fluid from the nozzle orifice through the first incompressible fluid, whereby the second incompressible fluid impinges against the semiconductor wafer.
A system for removing particles from a surface of a semiconductor substrate, comprising:
- a chamber having a volume configured to contain a first incompressible fluid at a fluid surface elevation and a substrate support below the fluid surface elevation, wherein the substrate supported is configured to hold the semiconductor substrate below the fluid surface elevation to be immersed in the first incompressible fluid;
- and
- a nozzle having an orifice configured to direct a stream of a second incompressible fluid from the nozzle onto a surface of the substrate, wherein the orifice of the nozzle is positioned below the fluid surface elevation to be immersed in the first incompressible fluid.
A system for detaching particles from a surface of a semiconductor substrate, the system comprising:
- a chamber comprising an entrance and an exit, the chamber being configured to conduct a flow of an incompressible fluid through the chamber;
- a substrate support positioned in the chamber and configured to receive and support a series of semiconductor substrates immersed in the incompressible fluid;
- a nozzle positioned in the chamber above the substrate support, the nozzle having an orifice immersed in the incompressible fluid;
- a fluid regulator connected to the nozzle and configured to supply the incompressible fluid pressurized to the nozzle, the nozzle being configured to direct a stream of the incompressible fluid from the nozzle orifice onto the surface of the substrate;
- and
- an actuator operably coupled to the nozzle to move the nozzle relative to the substrate to direct the stream of the incompressible fluid onto substantially the entire surface of each of the semiconductor substrates in the series.
Dependencies are inferred from the claim text.