Substrate processing apparatus
AssigneeHitachi Kokusai Electric Inc.
InventorsTetsuo Yamamoto, Naoki Matsumoto, Koichi Honda
Life of this patent
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AssigneeHitachi Kokusai Electric Inc.
InventorsTetsuo Yamamoto, Naoki Matsumoto, Koichi Honda
Estimating the term…
Provided is a substrate processing apparatus, which comprises a process chamber configured to process a substrate, a first plasma generation chamber in the process chamber, a first reactive gas supply unit configured to supply first reactive gas into the first plasma generation chamber, a pair of first discharge electrodes configured to generate plasma and to excite the first reactive gas, a first gas ejection port installed in a side wall of the first plasma generation chamber to eject an active species toward the substrate, a second plasma generation chamber in the process chamber, a second reactive gas supply unit configured to supply second reactive gas into the second plasma generation chamber, a pair of second discharge electrodes configured to generate plasma and to excite the second reactive gas, and a second gas ejection port installed in a side wall of the second plasma generation chamber to eject an active species.
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.