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US 2010/0252306 A1Published application
Interconnect substrates, methods and systems thereof
AssigneeMicro Components Ltd.
InventorsUri Mirsky, Shimon Neftin, Lev Furer
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Abstract
A method of enhancing thermal management of an electronic device comprising the steps of; forming an ALOX™ interconnect substrate; taking an electronic device; and interconnecting the electronic device to the interconnect substrate to yield a substantial split of thermal and electrical paths in the interconnect substrate.
Claims26
-42. (canceled)
An interconnect substrate comprising:
- a valve metal bulk region;
- and
- a first oxide layer,
- wherein the first oxide layer comprises at least a first portion having a first thickness and a second portion having a second thickness, wherein the first thickness is smaller than the second thickness and wherein the first portion is adapted to transfer heat from an electronic device to the bulk region and wherein the second portion is adapted to electrically isolate.
1 more element
A method of producing an interconnect substrate, the method comprising:
- anodizing a valve metal bulk region to form a first oxide layer, wherein the first oxide layer comprises at least a first portion having a first thickness and a second portion having a second thickness, wherein the first thickness is smaller than the second thickness and wherein the first portion is adapted to transfer heat from an electronic device to the bulk region and wherein the second portion is adapted to electrically isolate.
A method of enhancing thermal management of an electronic device comprising the steps of:
- forming an ALOX interconnect substrate;
- interconnecting the electronic device to the interconnect substrate to yield a substantial split of thermal and electrical paths between the substrate and the electronic device.
Dependencies are inferred from the claim text.