Advanced process control with novel sampling policy
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWang Jo Fei, Andy Tsen, Ming-Yu Fan, Jill Wang, Jong-I Mou
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Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a first plurality of semiconductor wafers; determining a sampling rate to the first plurality of semiconductor wafers based on process quality; determining sampling fields and sampling points to the first plurality of semiconductor wafers; measuring a subset of the first plurality of semiconductor wafers according to the sampling arte, the sampling fields and the sampling points; modifying a second process according to the measuring; and applying the second process to a second plurality of semiconductor waders.
Claims20
A semiconductor manufacturing method, comprising:
- performing a first process to a first plurality of semiconductor wafers each having a plurality of fields;
- determining a sampling rate to the first plurality of semiconductor wafers based on process quality;
- determining sampling fields and sampling points to the first plurality of semiconductor wafers;
- measuring a subset of the first plurality of semiconductor wafers according to the sampling rate, the sampling fields, and the sampling points;
- modifying a second process according to the measuring;
- and
- applying the second process to a second plurality of semiconductor wafers.
A semiconductor manufacturing method, comprising:
- performing a process to a plurality of semiconductor wafers;
- determining an optimal sampling rate to the plurality of semiconductor wafers based on process quality;
- measuring a portion of the first plurality of semiconductor wafers according to the optimal sampling rate;
- adjusting the process according to the measuring;
- and
- performing the adjusted process to another semiconductor wafer.
A semiconductor manufacturing system, comprising:
- a processing tool designed to process semiconductor wafers;
- a sampling module designed for determining a sampling rate to the semiconductor wafers according to metrology loading and product quality;
- a metrology tool for measuring a subset of the semiconductor wafers according to the sampling rate;
- and
- a process control module for adjusting a process according to measured results from the metrology tool.
Dependencies are inferred from the claim text.