Back to results
US 2010/0248494 A1Published application
Method of cleaning semiconductor wafers
AssigneeRohm and Haas Electronic Materials LLC
InventorsRobert K. Barr, Raymond Chan, Matthew L. Moynihan
Life of this patent
Estimating the term…
Abstract
A method of cleaning semiconductor wafers using an acid cleaner followed by an alkaline cleaner to clean contaminants from the materials is provided. The acid cleaner removes substantially all of the metal contaminants while the alkaline cleaner removes substantially all of the non-metal contaminants, such as organics and particulate material.
Claims8
A method comprising, in sequence, the following:
- a) applying an aqueous acid composition comprising one or more acids chosen from polycarboxylic acids and inorganic acids to a semiconductor wafer;
- and
- b) applying an aqueous alkaline composition comprising one or more alkaline compounds to the semiconductor wafer to remove metals and residue from the material.
Dependencies are inferred from the claim text.