E-chuck for automated clamped force adjustment and calibration
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJo Fei Wang, Sunny Wu, Jong-I Mou
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Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a wafer; measuring the wafer for wafer data after the first process; securing the wafer on an E-chuck in a processing chamber; collecting sensor data from a sensor embedded in the E-chuck; adjusting clamping forces to the E-chuck based on the wafer data and the sensor data; and thereafter performing a second process to the wafer secured on the E-chuck in the processing chamber.
Claims20
A semiconductor manufacturing method, comprising:
- performing a first process to a wafer;
- measuring the wafer for wafer data after the first process;
- securing the wafer on an E-chuck in a processing chamber;
- collecting sensor data from a sensor embedded in the E-chuck;
- adjusting clamping forces to the E-chuck based on the wafer data and the sensor data;
- and
- thereafter performing a second process to the wafer secured on the E-chuck in the processing chamber.
A semiconductor manufacturing method, comprising:
- positioning a wafer on a wafer stage in a processing chamber;
- feeding forward pre-measurement data to a process control module;
- collecting sensor data from a wafer stage sensor integrated with the wafer stage;
- generating a tuning target based on the pre-measurement data and the sensor data;
- adjusting clamping forces by the process control module based on the tuning target, wherein the clamping forces are applied to hold the wafer stage to the processing chamber;
- and
- thereafter performing a process to the wafer positioned on the wafer stage in the processing chamber.
A semiconductor manufacturing apparatus, comprising:
- a processing chamber designed to perform a process to a wafer;
- an electrostatic chuck (E-chuck) configured in the processing chamber and designed to secure the wafer, wherein the E-chuck includes an electrode and a dielectric feature formed on the electrode;
- a tuning structure designed to hold the E-chuck to the processing chamber by clamping forces, wherein the tuning structure is operable to dynamically adjust the clamping forces;
- a sensor integrated with the E-chuck and sensitive to the clamping forces;
- and
- a process control module for controlling the tuning structure to adjust the clamping forces based on pre-measurement data from the wafer and sensor data from the sensor.
Dependencies are inferred from the claim text.