Back to results
US 2010/0248155 A1Published application
Illumination Control Module, and Diffraction Illumination System and Photolithography System Including the Same, and Methods of Fabricating Semiconductors Using the Same
AssigneeSamsung Electronics Co., Ltd.
InventorsWoo-Seok Shim, Yong-Jin Chun, Suk-Joo Lee
Life of this patent
Estimating the term…
Abstract
An illumination control module, which enables one diffraction optical element (DOE) to be applied to various photolithography processes, and a diffraction illumination system and a photolithography system including the same are provided. The illumination control module includes a convex-ring-shaped upper lens, and a concave-ring-shaped lower lens.
Claims11
1-10. (canceled)
A method of fabricating a semiconductor, comprising:
- loading a wafer into a photolithography system, the wafer having a material layer and a photoresist layer thereon,
- irradiating the photoresist layer using UV light,
- developing the photoresist layer to form a photoresist pattern,
- patterning the material layer to form a material pattern using the photoresist pattern as a patterning mask,
- removing the photoresist pattern, and
- cleaning the wafer,
- wherein the photolithography system comprises:
- a convex ring-shaped upper lens;
- and
- a concave ring-shaped lower lens coaxial with the upper lens along the axis of light incident to the upper lens.
7 more elements
A method of fabricating a semiconductor, comprising:
- loading a wafer into a photolithography system, the wafer having a material layer and a photoresist layer thereon,
- irradiating the photoresist layer using UV light,
- developing the photoresist layer to form a photoresist pattern,
- patterning the material layer to form a material pattern using the photoresist pattern as a patterning mask,
- removing the photoresist pattern, and
- cleaning the wafer,
- wherein the photolithography system comprises a diffraction illumination system having a diffraction optical element and an illumination control module, the illumination control module comprising:
- a convex ring-shaped upper lens;
- and
- a concave ring-shaped lower lens coaxial with the upper lens along the axis of light incident to the upper lens.
7 more elements
A method of fabricating a semiconductor, comprising:
- loading a wafer into a photolithography system, the wafer having a material layer and a photoresist layer thereon,
- irradiating the photoresist layer using UV light,
- developing the photoresist layer to form a photoresist pattern,
- patterning the material layer to form a material pattern using the photoresist pattern as a patterning mask,
- removing the photoresist pattern, and
- cleaning the wafer,
- wherein the photolithography system comprises a light source, a diffraction optical element, an illumination control module, a condenser lens, a photomask stage, a relay lens, and a wafer stage,
- wherein the illumination control module comprises:
- a convex ring-shaped upper lens;
- and
- a concave ring-shaped lower lens coaxial with the upper lens along the axis of light incident to the upper lens.
8 more elements
Dependencies are inferred from the claim text.